Material layer thickness of Micro-Electro-Mechanical System(MEMS) surface manufacturing process is one of the significant parameters which determine the performance of MEMS devices,for example,the thickness of polysilicon layer and sacrificial layer directly determines the performance and longitudinal mobile range of MEMS devices,so the measurement and process control and monitoring of material layer thickness are very meaningful.The current material layer thickness test,which is mostly through optomechanical method,is too complex and expensive,and needs too much measuring time.Besides,it is difficult for the current method to integrate with the Process-control-monitor(PCM) system.In the paper,a novel electrical testing structure is developed to measure the material layer thickness,which is simple and convenient,and can be integrated with the MEMS measurement system easily.To validate the testing structures and testing models,the software Medici is used to carry out the closed-loop verification.The results show a good agreement between simulation results and theoretical results.